The invention provides a packaging method and structure of a feature-size-shrunk semiconductor device. The method comprises the following steps: providing a semiconductor substrate for producing a first product; producing a second product shrunk according to the size of the first product, the second product having a first top metal layer; depositing a dielectric layer; filling copper metal in a connection hole and flattening the copper metal to form a first bonding pad; forming a second top aluminium metal layer; carrying out covering with an insulating layer and making a second bonding pad; and aligning the second bonding pad and carrying out the wafer-level package test process. According to the packaging method and structure, the second bonding pad is added to the second product and the second top metal layer for connecting the first bonding pad and the second bonding pad serves as a transition layer, and the position of the size-shrunk bonding pad is converted to the position of the original product bonding pad, and thus the size-shrunk product can be packaged through the original packaging technology; and besides, through filling the copper metal and polishing the copper metal to enable the copper metal to be flush with the dielectric layer, not only the surface of the copper metal is flattened, but also good bonding quality can be ensured in the follow-up bonding process.