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发明授权
CN105023855B 一种快速生成高熔点接头的芯片键合方法及超声压头设计 有权

一种快速生成高熔点接头的芯片键合方法及超声压头设计
摘要：
本发明提供了一种快速生成高熔点接头的芯片键合方法及超声压头设计。本发明设计一种特殊振动压头结构，可以实现在芯片周围施加振动，而芯片不施加压力的情况下完成Sn基钎料在Cu基板快速润湿，并且能够强化接头和提高接头服役温度。与其他形成高温互连接头的芯片的键合方法相比，该方法能够在对芯片不施加压力、较短键合时间条件下获得高焊合率、高熔点、高强度(60～80MPa)、高热导率(50～80W/(m·K))、宽服役温度范围的效果。因此，该方法获得的芯片键合接头可以在高服役温度、高强度等恶劣环境下应用，尤其适用于宽带隙半导体器件的封装工艺中。
摘要（英）：

The invention provides a chip bonding method for fast generating a high-melting-point joint and ultrasonic pressure head design. The invention designs a special vibration pressure head structure capable of applying vibration around a chip, achieving fast wetting of Sn-based brazing filler metal on a Cu substrate when pressure is not applied to the chip, intensifying a joint and increasing the service temperature of the joint. Compared with another chip bonding method for forming a high-temperature interconnected joint, the method may acquire a high welded rate, a high melting point, high strength (60 to 80MPa), high thermal conductivity (50 to 80W/(m.K)), and a wide service temperature range when pressure is not applied to the chip and bonding time is short. As a result, a chip bonding joint acquired by the method can be used in severe environment with high service temperature and high strength, and is especially suitable for packaging technology of broad-band-gap semiconductor devices.

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