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发明授权
CN105144380B 光电半导体器件及制造其的方法 有权

光电半导体器件及制造其的方法
摘要：
一种光电半导体器件(500)包括：光电半导体芯片(600)，具有第一表面(601)和第二表面(602)；以及具有保护二极管的保护芯片(700)，具有第一表面(701)和第二表面(702)。半导体芯片和保护芯片被嵌入模制体(800)中。第一电接触(610)和第二电接触(620)设置在半导体芯片的第一表面上。第三电接触(710)和第四电接触(720)设置在保护芯片的第一表面上。第一电接触电连接至第三电接触。此外，第二电接触电连接至第四电接触。
摘要（英）：

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip with a first surface and a second surface. The component also includes a protective chip which has a protective diode, a first surface and a second surface. The semiconductor chip and the protective chip are embedded in a molded body. A first electrical contact and a second electrical contact are arranged on the first surface of the semiconductor chip. A third electrical contact and a fourth electrical contact are arranged on the first surface of the protective chip. The first electrical contact is electrically connected to the third electrical contact. In addition, the second electrical contact is electrically connected to the fourth electrical contact.

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