The present invention relates to an epoxy resin composition for a copper clad laminate, and an application of the epoxy resin composition. The epoxy resin composition may be used for the preparation of pre-pregs and copper clad laminates. By respectively using brominated bisphenol A and a phosphorus-containing phenolic aldehyde as bromine and phosphorus sources, and adjusting the proportions of the brominated bisphenol A and the phosphorus-containing phenolic aldehyde within the epoxy resin composition, the bromine content is controlled at 5-12%, the phosphorus content is controlled at 0.2-1.5%, and the flame retardancy achieves the level of UL94 V-0. Pre-pregs and laminates manufactured using the epoxy resin composition have reduced halogen content and improved heat resistance. Substrate pressure resistance is improved, moisture absorption is low, adhesion, reactivity and processability are good, comparative tracking index (CTI)>600V is satisfied, and production costs are significantly reduced.