The invention discloses a method for manufacturing characters of a printed circuit board. The method includes the following steps that S1, in the pre-process, a solder mask of the printed circuit board is manufactured; S2, solder resist ink with the same color as the needed characters is selected, and the viscosity of the solder resist ink is adjusted to an appropriate value; S3, a screen printing plate is prepared, and whole-plate screen printing is performed; S4, pre-baking is performed; S5, exposure and development are performed to obtain the characters of the printed circuit board; S6, after-baking is performed. The solder resist technological process is adopted for replacing a traditional character manufacturing process to manufacture the characters; the alignment accuracy of a solder resist exposure machine can reach the tolerance range of +/-20 micrometers which is far accurate than the tolerance range of +/-100 micrometers of human eye alignment, so that the alignment accuracy of the characters is greatly improved, and the undesirable phenomenon that the characters deviate or are printed on a bonding pad or become fuzzy easily is effectively reduced.