The invention provides a method for improving the overload resistance impact capacity of a semiconductor cooler. By the adoption of the method, the overload resistance impact capacity of the semiconductor cooler can be remarkably improved. According to the following technical scheme, the method includes the steps that firstly, the edges of bismuth telluride grains of three peripheral edges of the semiconductor cooler are covered and protected through epoxy glue, and vent holes are reserved in the bottom edge; a glue filling port of the semiconductor cooler is formed upwards, and the semiconductor cooler is vertically placed in a special tool so as to be heated; a glue injection needle cylinder is used for injecting the epoxy glue into the semiconductor cooler from the glue filling port under assistance of compressed air; after encapsulation is completed, the semiconductor cooler with the epoxy glue encapsulated and cooling fins of the semiconductor cooler are continuously heated, so that the epoxy glue fully flows in the cooling fins to soak all the bismuth telluride grains and the inner walls of ceramic boards, and air bubbles in the semiconductor cooler are exhausted; and finally, the cooling fins are taken out from the special tool and vertically placed so as to be naturally solidified for at least 24 h. By the adoption of the method, the problem that bismuth telluride grains are easy to break when bearing force or ceramic boards are damaged in the high overload environment in the prior art is solved.