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发明授权
CN105378899B 切割片 有权

切割片
摘要：
本发明提供一种切割片(1)，其具有基材(2)以及层叠在基材(2)的至少一个面上的粘合剂层(3)，粘合剂层(3)由含有丙烯酸类聚合物(A)以及多官能丙烯酸酯类能量线聚合性化合物(B)的粘合剂组合物形成，多官能丙烯酸酯类能量线聚合性化合物(B)是在1g该多官能丙烯酸酯类能量线聚合性化合物(B)中具有0.004～0.009摩尔的聚合性官能团，多官能丙烯酸酯类能量线聚合性化合物(B)占丙烯酸类聚合物(A)及多官能丙烯酸酯类能量线聚合性化合物(B)的总量的比例为20～65质量％，粘合剂层(3)的厚度为2～20μm。根据所述切割片(1)，在将如半导体封装那样表面粗糙度较大的工件作为被粘物时，在照射能量线之前具有充分的粘合力，在照射能量线之后也具有适度的粘合力，并且很难产生粘合剂聚集物。
摘要（英）：

This dicing sheet (1) comprises a substrate (2) and a pressure-sensitive-adhesive layer (3) laminated to at least one surface of said substrate (2). Said pressure-sensitive-adhesive layer (3) is 2 to 20 µm thick and is made from a pressure-sensitive-adhesive composition that contains both an acrylic polymer (A) and a polyfunctional acrylate energy-ray-polymerizable compound (B). Said polyfunctional acrylate energy-ray-polymerizable compound (B) contains 0.004 to 0.009 moles of polymerizable functional groups per gram and constitutes 20% to 65% of the combined mass of the acrylic polymer (A) and the polyfunctional acrylate energy-ray-polymerizable compound (B). When adhered to a high-surface-roughness workpiece such as a semiconductor package, this dicing sheet (1) exhibits sufficient adhesive strength before energy-ray exposure, also exhibits appropriate adhesive strength after energy-ray exposure, and is resistant to the formation of pressure-sensitive-adhesive aggregates.

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