The invention relates to the technical field of printed circuit boards, especially to a two-layer-process double-sided flexible copper-clad plate. The copper-clad plate comprises an upper copper foil layer, a lower copper foil layer and a polyimide insulating layer sandwiched between the two copper foil layers. According to the invention, a thermosetting polyimide glue solution and a thermoplastic polyamide acid resin glue solution are mixed so as to obtain a thermoplastic polyamide acid-thermosetting polyimide mixed solution; the thermoplastic polyamide acid-thermosetting polyimide mixed solution is coated on the surface of one copper foil at a time; and then the thermoplastic polyamide acid resin glue solution is subjected to imidization and is then pressed together with another copper foil, so the two-layer-process double-sided flexible copper-clad plate is prepared. Coating once and pressing once are carried out, so a production process for the two-layer-process double-sided flexible copper-clad plate is substantially simplified and production efficiency is improved; and the prepared copper-clad plate has a high qualified rate and good comprehensive properties like peeling strength, dimensional stability and heat resistance.