The invention discloses a method for manufacturing a resistance welding circuit board. The method comprises the steps of covering the surface of the circuit board with printing ink and pre-curing the printing ink; enabling a first exposure negative plate to be aligned with the surface of the circuit board; performing non-vacuum exposure on the surface of the circuit board to enable the first exposure negative plate not to be tightly attached to the surface of the circuit board; removing the first exposure negative plate, and enabling a second exposure negative plate to be aligned with the surface of the circuit board; performing vacuum exposure on the surface of the circuit board to enable the second exposure negative plate to be tightly attached to the surface of the circuit board to obtain the resistance welding circuit board. By adoption of the embodiment of the method for manufacturing the resistance welding circuit board, the formation of the negative plate imprint is avoided and the production cost is low.