This resistor is provided with a resistor body, a protection film, electrodes, and a plating layer. The resistor body is configured from a board-like metal, the protection film is formed on a center section of an upper surface of the resistor body, and the plating layer is formed to cover the electrodes. The electrodes are configured by means of printing using a metal-containing paste, said electrodes being formed on both the end sections of the upper surface of the resistor body by being spaced apart from each other with the protection film therebetween.