The invention discloses a sample bonding die and method. The sample bonding die comprises a sleeve device and a rotary device, wherein the sleeve device comprises a sleeve used for containing a sample to be bonded, a sleeve holder used for fixing the sleeve, and a clamping screw used for clamping the sleeve; the rotary device comprises a rotation arm fixed to the sleeve holder, a rotary sleeve fixed to the other end of the rotation arm and fixedly installed on the center axis of the interior of a pipe base, the pipe base used for rotation of a locking device, and the locking device; the locking device comprises a handle and a locking rod, one end of the locking rod is fixedly connected with the rotary sleeve, the other end of the locking rod is connected with the handle, and the rotary sleeve can be made to rotate by 0-90 DEG C by rotating the handle. By means of the structural design, coaxiality of components of a bonded sample can be guaranteed, bonding of the sample and an inner cavity of the die through a bonder is avoided, and test reliability is improved.