The present invention belongs to the field of the semiconductor heat radiation, and especially relates to a novel packaging inner chip heat radiation assembly and a heat radiation system. The chip heat radiation assembly comprises a heat radiation assembly 1, a heat radiation assembly 2, a pad and pipelines in the assembly; the heat radiation assembly 1 is fixedly arranged on the chip substrate and located around the sides of the chip; the heat radiation assembly 2 is arranged at the top of the chip, and the heat radiation assembly 1 and the heat radiation assembly 2 are connected through the pad to form an enclosed pipeline; the pipelines in the assembly are distributed in the heat radiation assembly 1 and the heat radiation assembly 2 are configured to pump in coolant, the pipelines in the assembly are also provided with the inlets and the outlets of the pipeline in the assembly, and the inlets and the outlets of the pipeline in the assembly pass through the chip substrate to connect with required external devices. The heat radiation assembly/system greatly improves the heat radiation efficiency of a whole device, and is integrated in/out of a packaging body so as to realize miniaturization, have high practicality and be applicable to a plurality of fields and widely popularized.