A thermal transfer printing method used for printing a pattern of a film onto a workpiece is provided. The workpiece has a plurality of blocks. The thermal transfer printing method includes, disposing the film and the workpiece into a mold cavity, heating and providing negative pressure to the mold cavity, such that the film is extended and contacts the blocks in sequence; heating the mold cavity to a first temperature when the film contacts one of the blocks, such that the film is adhered to the block; cooling the mold cavity to be lower than the first temperature, such that the film contacts another block then; and heating the mold cavity to a second temperature when the film being adhered to all blocks of the workpiece, such that the pattern of the film is transfer printed onto the workpiece.