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发明公开
CN105732972A 孔隙填充组合物 失效 - 放弃专利权

孔隙填充组合物
摘要：
一种孔隙填充组合物。本发明涉及一种组合物，其包含聚合物和溶剂，其中所述聚合物包含：以下通式(I)重复单元：其中：Ar1、Ar2、Ar3和Ar4独立地表示任选地被取代的二价芳香族基团；X1和X2独立地表示单键、-O-、-C(O)-、-C(O)O-、-OC(O)-、-C(O)NR1-、-NR2C(O)-、-S-、-S(O)-、-SO2-或任选地被取代的C1-20二价烃基，其中R1和R2独立地表示H或C1-20烃基；m是0或1；n是0或1；并且o是0或1；和不含可聚合乙烯基和羟基的封端基团。所述组合物在半导体装置制造中发现特定可应用性，用于形成低k和超低k介电材料。
摘要（英）：

The invention provides a pore-fill composition. The composition comprises a polymer and a solvent, wherein the polymer comprises: a repeat unit of the following general formula (I): wherein: Ar1, Ar2, Ar3 and Ar4 independently represent an optionally substituted divalent aromatic group; X1 and X2 independently represent a single bond, -O-, -C(O)-, -C(O)O-, -OC(O)-, -C(O)NR1-, -NR2C(O)-, -S-, -S(O)-, -SO2- or an optionally substituted C1-20 divalent hydrocarbon group, wherein R1 and R2 independently represent H or a C1-20 hydrocarbyl group; m is 0 or 1; n is 0 or 1; and o is 0 or 1; and an endcapping group that is free of polymerizable vinyl groups and hydroxyl groups. The compositions find particular applicability in the manufacture of semiconductor devices for forming low-k and ultra-low-k dielectric materials.

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