利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN105754348A 一种低填充高导热的有机无机复合物 无效 - 驳回

一种低填充高导热的有机无机复合物
摘要：
本发明公开了一种低填充高导热的有机无机复合物，所述低填充高导热的有机无机复合物，以重量份数计，包含50?1000份有机组分作为散热基体，100?400份的片状无机物作为第一导热填料，10?800份的非片状无机物作为第二导热填料。本发明的有机无机复合物，通过多种形貌的无机导热填料复配，在有机散热基体中形成2维/3维、2维/1维的导热网络，具有较高的导热性能和良好的贮存稳定性。
摘要（英）：

The invention discloses a low-filling high-heat-conductivity organic-inorganic compound which comprises, by weight, 50-1000 parts of organic component serving as a heat-radiating matrix, 100-400 parts of flaky inorganic matter serving as a first heat-conducting filler and 10-800 parts of non-flaky inorganic matter serving as a second heat-conducting filler.A heat-conducting network of two dimension/three dimension and two dimension/one dimension is formed in the organic heat-radiating matrix by compounding the inorganic heat-conducting fillers various in shape, so that the low-filling high-heat-conductivity organic-inorganic compound has high heat conductivity and good storage stability.

0/0