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发明公开
CN105762253A 封装结构及其制法与成型基材 无效 - 撤回

封装结构及其制法与成型基材
摘要：
一种封装结构及其制法与成型基材，该成型基材包括：离型膜；以及形成于该离型膜上的多个荧光颗粒，且各该荧光颗粒间具有多个空气间隙，所以本发明的封装结构的制法，先设置至少一发光组件于一承载件上，再形成透明黏固胶体层于该承载件与该发光组件上，再设置该成型基材于该透明黏固胶体层上，且该些荧光颗粒位于该透明黏固胶体层与该离型膜之间，使该透明黏固胶体层流入该空气间隙中，以固定该些荧光颗粒而成为荧光层，之后移除该离型膜，藉以得到均匀的荧光层。
摘要（英）：

The molded substrate includes: a release film; and a plurality of phosphor particles formed on the release film, wherein the phosphor particles have gaps therebetween. A method of manufacturing a package structure is also provided, including: disposing at least one light emitting element on a carrier; forming a transparent adhesive layer on a surface of the light emitting element; disposing the molded substrate on the transparent adhesive layer with the phosphor particles disposed between the transparent adhesive layer and the release film; filling the transparent adhesive layer into the gaps of the phosphor particles to form a phosphor layer; and removing the release film, so as to obtain an even phosphor layer.

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