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发明授权
CN105779980B 一种化学镀铜剂及其制备方法 有权

一种化学镀铜剂及其制备方法
摘要：
本发明属于电路板制造技术领域，涉及一种化学镀铜剂及其制备方法，其中化学镀铜剂的组分和重量百分比为：EDTA‑2Na0.03‑0.04％、硫酸铜0.005‑0.007％、氢氧化钠0.003‑0.007％、EDTP 0.002‑0.005％、甲醛0.002‑0.004％、甲醇0.003‑0.005％、己二酸0.01‑0.05％、丁二酸0.005‑0.01％，其余为去离子水。本发明化学镀铜剂不仅能达到RoHS标准，而且相对于CuCl2体系镀铜剂附着力以及耐湿热性能更强。
摘要（英）：

The invention belongs to the technical field of circuit board manufacturing and relates to a chemical copper plating agent and a preparation method thereof. The chemical copper plating agent is composed of, by weight percentage, 0.03-0.04% of EDTA-2Na, 0.005-0.007% of copper sulfate, 0.003-0.007% of sodium hydroxide, 0.002-0.005% of EDTP, 0.002-0.004% of formaldehyde, 0.003-0.005% of methyl alcohol, 0.01-0.05% of adipic acid, 0.005-0.01% of succinic acid, and the balance deionized water. The chemical copper plating agent not only can meet the RoHS standard, but also has higher adhesive force and heat-wet resistance compared with CuCl2 system copper plating agents.

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