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发明公开
CN105792083A 微机电麦克风封装 有权

微机电麦克风封装
摘要：
本发明公开一种微机电麦克风封装，其包含一基板、至少一微机电麦克风、至少一集成电路芯片及一导电盖体。基板包含至少一第一开孔。至少一微机电麦克风电连接基板。至少一集成电路芯片电连接基板。导电盖体包括至少一第二开孔。导电盖体与基板接合以形成一容纳微机电麦克风与集成电路芯片的空腔。至少一第一开孔与至少一第二开孔适当地排列以共同形成至少一音孔。
摘要（英）：

The invention discloses an MEMS microphone package. The MEMS microphone package includes a substrate, at least one MEMS microphone, at least one IC chip, and a conductive cover. The substrate includes at least one first hole. The at least one MEMS microphone is electrically coupled to the substrate. The at least one IC chip is electrically coupled to the substrate. The conductive cover includes at least one second hole. The conductive cover is bonded to the substrate to form a chamber accommodating the MEMS microphone and the IC chip. At least one acoustic hole is formed by aligning the at least one first hole and the at least one second hole.

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