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发明公开
CN105826210A 一种功率器件模块封装用陶瓷基板与散热器的连接方法 无效 - 撤回

一种功率器件模块封装用陶瓷基板与散热器的连接方法
摘要：
本发明公开了一种功率器件模块封装用陶瓷基板与散热器的连接方法，步骤如下：步骤一、采用机械球磨法制备陶瓷基板金属化粉末；步骤二、对陶瓷基板进行表面金属化处理；步骤三、陶瓷基板表面金属化层减薄处理；步骤四、陶瓷基板与散热器连接，本发明主要用于功率器件模块封装用陶瓷基板与散热器的连接，采用本发明的连接方法实现了功率器件模块封装用陶瓷基板与散热器的冶金连接，有效的提高了功率模块封装用陶瓷基板与散热器之间的热导率，进而提高了功率器件的使用寿命。
摘要（英）：

The invention discloses a connecting method for a radiator and a ceramic substrate for power device module packaging. The method comprises the steps that 1, a mechanical ball milling method is adopted for preparing ceramic substrate metallized powder; 2, surface metallizing treatment is performed on the ceramic substrate; 3, metallized layer thinning treatment is performed on the surface of the ceramic substrate; 4, the ceramic substrate and the radiator are connected. The method is mainly used for connecting the radiator and the ceramic substrate for power device module packaging, the connecting method is adopted for achieving metallurgical connection of the radiator and the ceramic substrate for power device module packaging, the heat conductivity between the radiator and the ceramic substrate for power module packaging is effectively increased, and the service life of a power device is prolonged.

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