The present disclosure provides a vacuum ring for removing bubbles of a laminated assembly and a method for bonding the laminated assembly using the same. The vacuum ring includes a recess portion formed in the inner side so that the upper and lower ends of the recess portion are respectively hermetically in contact with the top surface and the bottom surface of the laminated assembly. The upper and lower ends of the recess portion are disposed at an angle part of the laminated assembly to form an inner space. The inner space is communicated with a vacuum source so as to remove the bubbles among layers of the laminated assembly and bubbles in the vacuum ring. The vacuum ring also includes a plurality of projection members that are projected inside on the bottom of the recess portion at positions where the projection members are separated, by a distance corresponding to the thickness of the laminated assembly, upward from a lower end of the recess portion to receive the laminated assembly, and the projections members are separated, by a configured interval, downward from the upper end of the recess portion. Further, the laminated assembly is produced by using the vacuum ring to achieve effective exhaustion by using an aperture formed between side ends of the projection members and the bonding cover.