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CN105960708B 采用单向加热的使用钢化玻璃的基板翘曲控制 失效 - 权利终止

采用单向加热的使用钢化玻璃的基板翘曲控制
摘要：
一种方法，包括将集成电路封装基板固定在第一和第二支撑基板之间；将被固定住的封装基板从单一方向暴露于热源；以及改变所述封装基板的形状。一种装置，包括第一和第二支撑基板，第一支撑基板包括是封装基板第一面的面积的75％至95％的二维面积，而第二支撑基板包括是与封装基板的面积至少相等的二维面积，并且第一支撑基板和第二支撑基板都包括其中具有腔的主体，从而使得在被组装于封装基板相对的面上时，每个腔具有使得支撑基板的主体不与封装基板的区域接触的容积尺寸。
摘要（英）：

A method including clamping an integrated circuit package substrate between first and second supporting substrates; exposing the clamped package substrate to a heat source from a single direction; and modifying a shape of the package substrate. An apparatus including a first and second supporting substrates, the first supporting substrate including a two-dimensional area that is 75 percent to 95 percent of the area of the first side of the package substrate and the second supporting substrate including a two-dimensional area that is at least equivalent to the area of a package substrate and each of the first supporting substrate and the second supporting substrate include a body having a cavity therein such that when assembled on opposite sides of a package substrate, each cavity has a volume dimension such that the body of the supporting substrate is not in contact with an area of a package substrate.

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