A quality management device for controlling a surface mounting line including a solder printing device for printing solder onto a printed substrate, a mounter for disposing an electronic component on the substrate, a first inspection device for inspecting the printing state of the solder and the disposal state of the electronic component, a reflow furnace for performing solder bonding, and a second inspection device for inspecting the bonding state of the solder, wherein provided are: a defect factor estimation means for extracting an inspection item estimated to be related to a defect from among inspection items inspected by the first inspection device when the second inspection device detects the defect; a quality determination means for acquiring an inspection result that corresponds to the extracted inspection item and determining whether or not the inspection result indicates an abnormality; and a parameter changing means for determining, when the inspection result indicates an abnormality, the parameter to be changed from among parameters used by the solder printing device or the mounter, and the particulars of the change.