The invention discloses a manufacturing method of a substrate-free packaging device. The method comprises the following steps of (1) providing an auxiliary board; (2) forming a temporary sticky film; (3) manufacturing a metal layer; (4) patterning the metal layer and reserving a chip placement vacancy; (5) pasting a chip, namely pasting the chip on the chip placement vacancy reserved in the step (4) and tightly pasting the chip on the upper surface of the temporary sticky film; (6) carrying out electrical interconnection, namely achieving electrical interconnection of the chip and a circuit layer through a wire bonding method; (7) manufacturing a molding packaging body, namely forming the packaging body of a molding compound through a molding packaging technology; and (8) manufacturing the substrate-free packaging device, namely removing the temporary sticky film and the corresponding auxiliary board at a viscosity failure temperature of the temporary sticky film, and baking and cooling the packaging body to obtain the substrate-free packaging device. By the manufacturing method, the manufacturing technology is simple; the cost is low; the yield is high; and the manufacturing method is suitable for massive production.