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发明公开
CN106316089A 基板分割装置及基板分割方法 有权

基板分割装置及基板分割方法
摘要：
本发明涉及基板分割装置及基板分割方法。其课题在于在分割贴合基板时，压入量的最适合范围宽，能够可靠地形成良好的裂纹，并且特别能够容易地除去端材。基板分割装置是具有第1基板(G1)和第2基板(G2)的贴合基板(G)的分割装置，所述第1基板(G1)的表面形成有用于切掉端部的刻划线(S)，所述第2基板(G2)贴合在第1基板(G1)的背面。该分割装置具有按压部(11)和吸附部(12)。按压部(11)从第1基板(G1)侧按压成为端材的端部(GL)而沿着刻划线(S)分割端部(GL)。吸附部(12)对利用按压部(11)分割后的端部(GL)进行吸附而从第1基板(G1)取掉端部(GL)。
摘要（英）：

The present invention relates to a substrate segmentation apparatus and a substrate segmentation method. The problem is that when a bonded substrate is divided, good cracks can be reliably formed via a press-fitting width of an optimum range, and end material can be easily removed. The substrate dividing means is a dividing means for a bonded substrate (G) having a first substrate (G1) and a second substrate (G2), and the surface of the first substrate (G1) has a scribe line for cutting the end portion (S), and the second substrate (G2) is bonded to the back surface of the first substrate (G1). The dividing means has a pressing portion (11) and an attraction portion (12). The pressing portion (11) presses the end portion (GL) from the first substrate (G1) side so as to divide the end portion (GL) along the scribe line (S). The adsorption portion (12) absorbs the end portion (GL) segmented from the pressing portion (11) and removes the end portion (GL) from the first substrate (G1).

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