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发明公开
CN106324648A 半导体探测器及其封装方法 审中-实审

半导体探测器及其封装方法
摘要：
本发明提出了一种半导体探测器及其封装方法。所述半导体探测器包括：阳极电路板，包括读出芯片；阴极电路板，所述阴极电路板包括阴极电路板高压端顶层、阴极电路板底部连接层和填充在阴极电路板高压端顶层和阴极电路板底部连接层之间的电介质，所述阴极电路板高压端顶层和阴极电路板底部连接层通过过孔连接；探测器晶体，包括晶体主体、阳极和阴极，所述阳极与所述阳极电路板上的读出芯片相连，其中所述阴极电路板高压端顶层用于连接半导体探测器的输入，所述阴极电路板底部连接层与所述探测器晶体的阴极直接接触而连接所述阴极和所述阴极电路板。
摘要（英）：

The invention provides a semiconductor detector and a packaging method thereof. The semiconductor detector comprises an anode circuit board, a cathode circuit board and a detector crystal, wherein the anode circuit board comprises a read-out chip; the cathode circuit board comprises a cathode circuit board high voltage end top layer, a cathode circuit board bottom connecting layer and a dielectric filled between the cathode circuit board high voltage end top layer and the cathode circuit board bottom connecting layer, and the cathode circuit board high voltage end top layer and the cathode circuit board bottom connecting layer are connected through via holes; and the detection crystal comprises a crystal main body, an anode and a cathode, and the anode is connected with the read-out chip on the anode circuit board. The cathode circuit board high voltage end top layer is used for connecting input of the semiconductor detector, the cathode circuit board bottom connecting layer is directly contacted with the cathode of the detection crystal so as to connect the cathode and the cathode circuit board.

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