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发明公开
CN106328625A 封装基板及其制作方法 有权

封装基板及其制作方法
摘要：
本发明公开一种封装基板及其制作方法。该封装基板的制作方法为，提供及压合第一铜层及已形成于其上的第一电镀铜层、第一介电层、第二铜层及已形成于其上的第二电镀铜层、第二介电层及第三铜层及已形成于其上的第三电镀铜层，以使第一与第二介电层完全包覆第二铜层与第二电镀铜层的边缘，而形成暂时承载板。形成二线路结构于暂时承载板的相对两表面上。切割暂时承载板与线路结构，以暴露出第二铜层与第二电镀铜层的边缘。沿着被暴露出的第二铜层与第二电镀铜层的边缘分离暂时承载板与线路结构，而形成二各自独立的封装基板。
摘要（英）：

The invention discloses a package substrate and a manufacturing method thereof. According to the method of manufacturing the package substrate, a first copper layer and a first plating copper layer formed thereon, a first dielectric layer, a second copper layer and a second plating copper layer formed thereon, a second dielectric layer, a third copper layer and a third plating copper layer formed thereon are provided and laminated, so that the first and the second dielectric layers encapsulate edges of the second copper layer and the second plating copper layer to form a temporary carrier. Two circuit structures are formed on two opposite surfaces of the temporary carrier. The temporary carrier and the circuit structures are cut to expose the edges of the second copper layer and the second plating copper layer, and separated along the exposed edges of the second copper layer and the second plating copper layer to form two package substrates independent from each other.

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