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发明授权
CN106363315B 一种镀锡碳纳米材料增强复合焊料合金及其焊膏 有权

一种镀锡碳纳米材料增强复合焊料合金及其焊膏
摘要：
本发明提供了一种镀锡碳纳米材料增强复合焊料合金及其焊膏，所述镀锡碳纳米材料增强复合焊料合金包含的组分及其重量份数为：锡基焊料84‑95份，碳纳米材料0.01‑0.2份；所述镀锡碳纳米材料增强复合焊膏还包括助焊剂5‑15份。采用本发明的技术方案，提高了镀锡碳纳米材料增强复合焊料合金及其焊膏所形成焊点的抗蠕变性能、导电性和耐热老化性能；所制得焊膏中碳纳米材料分布均匀，工艺简单可靠、适应性强且成本低廉。
摘要（英）：

The invention provides tinned carbon nanomaterial reinforced compound solder alloy and solder paste thereof. The tinned carbon nanomaterial reinforced compound solder alloy comprises, by weight, 84-95 parts of tin-based solder, 0.01-0.2 part of carbon nanomaterials and 5-15 parts of soldering flux. By the adoption of the technical scheme, the creep resistance, electrical conductivity and thermal aging resistance of soldered dots generated by the tinned carbon nanomaterial reinforced compound solder alloy and the solder paste thereof are improved. The carbon nanomaterials in the prepared solder paste are uniform in distribution, the process is simple and reliable, adaptability is high, and cost is low.

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