The invention discloses preparation of a high-heat-conductive nano fluid adhesive and an application thereof in production of artificial boards. The adhesive includes, by mass, 1-15% of high-heat conductivity metal nano particles, metal oxide nano particles or non-metal nano particles, 83-98.8% of an adhesive for production of a fiber board or a particle board, 0.1-1% of a surfactant or a dispersant, and 0.1-1% of a defoamer, all the components are mixed and are subjected to supersonic vibration to form the adhesive. The invention also discloses a preparation method of the adhesive and an application thereof in production of the artificial boards. The high-heat-conductive nano fluid adhesive has the character that the heat conductivity is significantly increased, so that the adhesive can significantly increase drying speed of the fibers and wood particles after application of the adhesive during production of the fiber board or the particle board, and meanwhile, can significantly reduce hot-pressing time or reduce the hot-pressing temperature of the fiber board or the particle board.