The invention discloses a semiconductor device and a manufacturing method thereof. A semiconductor comprises a plurality of semiconductor bare cores, wherein the semiconductor bare cores are stacked into one-dimensional blocks of the semiconductor bare cores, and conductive patterns are formed along the edges of the one-dimensional blocks, so that the semiconductor bare cores in the one-dimensional blocks are electrically coupled with one another and electrically coupled with an external electric connector. In a further example, the one-dimensional blocks can be arranged into one another to form two-dimensional semiconductor blocks and three dimensional semiconductor blocks.