The invention relates to a chuck for a wet-process single wafer cleaning machine platform. The chuck comprises a chuck body, a chuck base, a bearing, a snap ring and buckles, wherein the chuck base and the snap ring are both arranged on the chuck body; the inner side of the bearing sleeves the outer side of the chuck base; the inner side of the snap ring sleeves the outer side of the bearing; a plurality of buckles are distributed on the chuck body along the outer side edge of the snap ring and are used for limiting the snap ring; and the chuck base is fixedly connected to the bearing through clamping locks. According to the chuck for the wet-process single wafer cleaning machine platform, the clamping locks are added between the chuck base and the bearing, when the chuck base is worn, the relative motion between the chuck base and the snap ring can be avoided and the wear of the buckles is reduced, so that worse wafer etching flatness and even wafer fragments, which are caused by sharp wear of the buckles, are avoided, and meanwhile, the service cycle of the chuck base is improved.