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Invention Grant
CN106604567B 布线基板和其制造方法 有权

布线基板和其制造方法
Abstract:
本发明提供布线基板和其制造方法，该布线基板包括：布线层，其形成于由陶瓷构成的基板主体的表面；焊盘，其一端部连接于该布线层，该布线基板不会在陶瓷层之间形成间隙，能够自由地设定焊盘的尺寸。布线基板(1)包括：基板主体(2)，其由陶瓷(c1)构成且具有彼此相对的一对表面(3、4)；布线层(10、14)，其沿着该基板主体的一个表面(3)形成；焊盘(9)，其形成于基板主体的所述一个表面(3)且与布线层(10、14)相连接，布线层(10、14)的底部侧埋设在比基板主体的表面(3)靠该基板主体的内部的位置，俯视时焊盘的局部与布线层(10、14)的局部重叠，该焊盘的厚度大于布线层(10、14)的靠表面(3)侧的露出部分的厚度。
Abstract(English):

PROBLEM TO BE SOLVED: To provide a wiring board which includes wiring layers formed on a surface of a substrate body made of ceramic and a pad connected with the wiring layer on one end side, and in which a gap is not formed between ceramic layers and the size of the pad can be set with freedom; and provide a manufacturing method of the wiring board.SOLUTION: A wiring board 1 comprises: a substrate body 2 which is made of ceramic c1 and has a pair of opposite surfaces 3, 4; wiring layers 10, 14 formed along the one surface 3 of the substrate body 2; and a pad 9 which is formed on the one surface 3 of the substrate body 2 and connected with the wiring layers 10, 14, in which the bottom side of each of the wiring layers 10, 14 is embedded inside the substrate body 2 than the surface 3 of the substrate body 2, and the pad 9 partially overlaps part of the wiring layers 10, 14 and a thickness of the pad 9 is thicker than that of en exposed portion of the wiring layers 10, 14 on the surface 3 side.SELECTED DRAWING: Figure 1

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