The invention relates to a pulse heat pipe, in particular to a silicon-based micro pulse heat pipe with micro/nano composite structures. The micro pulse heat pipe is formed by bonding a semiconductor silicon wafer and a heat-resisting borosilicate glass piece which are in a pair. Vacuum pumping/liquid injecting holes are machined in the borosilicate glass piece. The vacuum pumping/liquid injecting holes correspond to the positions of the top ends of vacuum pumping/liquid injecting micro slots in the semiconductor silicon wafer. Multiple micro slots are etched in the semiconductor silicon wafer, and the surfaces of the micro slots are the micro/nano composite structures formed by carbon nano pipe bundles. According to the silicon-based micro pulse heat pipe with the micro/nano composite structures, the defects that an evaporation section of a common micro pulse heat pipe is likely to be burnt out, the starting temperature is too high, and the starting time is too long are overcome; and the purposes of improving the heat pipe cooling temperature control performance and improving the heat load bearing capability can be achieved by changing the channel section size of the pulse heat pipe, changing the shape of the micro slot surface carbon nano pipe bundles and the like.