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发明公开
CN106783820A 白光LED模组芯片及其制作方法和白光LED模组 无效 - 驳回

白光LED模组芯片及其制作方法和白光LED模组
摘要：
本发明公开了一种白光LED模组芯片和白光LED模组，包括：多个呈阵列排布的倒装型LED芯片；填充于多个倒装型LED芯片之间的连接物质，该连接物质用于连接多个倒装型LED芯片，以形成LED阵列；涂覆在LED阵列的发光面及连接物质的顶面上的荧光胶层，该荧光胶层用于激发多个LED阵列发出白光。本发明的白光LED芯片和模组能够提升光源模组制作过程中的贴片效率、减少贴片所耗时间成本。本发明还提供一种白光模组芯片的制作方法。
摘要（英）：

The invention discloses a white-light LED module chip and a white-light LED module. The white-light LED module chip comprises a plurality of inverted LED chips which are arrayed, connecting substances and a fluorescent adhesive layer, wherein the connecting substances are filled among the inverted LED chips and used for connecting the inverted LED chips to form LED arrays; the light-emitting faces of the LED arrays and the top surfaces of the connecting substances are coated with the fluorescent adhesive layer used for exciting the LED arrays to emit white light. The white-light LED module chip and the white-light LED module have the advantages that the surface mounting efficiency during light source module manufacturing can be increased, and surface mounting time consumption can be reduced. The invention further provides a manufacturing method of the white-light LED module chip.

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