The invention discloses a punching method for forming a blind hole by using laser on a multi-layer circuit board. The punching method for forming the blind hole by using the laser on the multi-layer circuit board comprises the following steps: carrying out micro-etching treatment on a copper surface layer to be processed in the multi-layer circuit board so as to micro-etch a part of the copper layer and reserve the copper surface layer with a preset thickness; carrying out browning treatment on the copper surface layer with the preset thickness and enabling the copper surface layer to be oxidized and blackened so as to form a transition layer; using CO2 laser to carry out laser drilling treatment at an appointed position of the transition layer of the multi-layer circuit board so as to form the blind hole. Through the technical scheme, the capacity of manufacturing the ratio of thickness to radial dimension of the blind hole can be improved, and when the ratio of thickness to radial dimension of the blind hole reaches 1.4: 1 through testing, the problems such as holes or cracks of the blind hole cannot appear, so that the hole formation effect of the blind hole is improved.