The present invention addresses the issues of, when providing and electrically connecting Cu pillars to semiconductor chips, increasing the height/diameter ratio of Cu pillars, improving productivity, enabling the height of Cu pillars to be increased, and increasing the reliability of Cu pillars, in comparison to methods whereby Cu pillars are formed by plating. In order to solve said issues, a material for Cu pillars is pre-formed as a cylindrical formed body and this cylindrical formed body is electrically connected to an electrode upon a semiconductor chip, to provide a Cu pillar. As a result, the height/diameter ratio of Cu pillars can be at least 2.0. Electric plating is not used, therefore the time required for Cu pillar production can be shortened and productivity improved. In addition, the Cu pillar height can be at least 200 [mu]m, making the Cu pillars suitable for molded underfill. Components can be freely adjusted, thereby enabling easy design of alloy components for highly reliable Cu pillars.