The present invention has as its theme the provision of Cu pillars on a semiconductor chip and electrical connection of the same during which able to enlarge a height/diameter ratio of the Cu pillars, improve the productivity, and raise the height of the Cu pillars and thereby improve the reliability of the Cu pillars compared with the method of forming Cu pillars by plating. The present invention solves this problem by forming the material for the Cu pillars as cylindrical preforms in advance and connecting these cylindrical preforms to electrodes on the semiconductor chip to form Cu pillars. Due to this, it becomes possible to make the height/diameter ratio of the Cu pillars 2.0 or more. Since electroplating is not used, the time required for production of the Cu pillars is short and the productivity can be improved. Further, the height of the Cu pillars can be raised to 200 µm or more, so these are also preferable for moldunderfill. The components can be freely adjusted, so it is possible to easily design the alloy components to obtain highly reliable Cu pillars.