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发明公开
CN106935564A 集成电路封装结构 无效 - 驳回

集成电路封装结构
摘要：
本发明公开一种集成电路封装结构，包括引线框、晶振和芯片，所述晶振和芯片均与引线框连接，所述晶振和芯片位于引线框的同一表面上。本发明通过将芯片和晶振放置在引线框的同一表面上，避免了在引线框上键合芯片时，引线框出现变形导致产品的异常，减少产品生产中的浪费，降低生产成本；同时优化了内部布局；消除了晶振在封装后出现频率偏移的现象。
摘要（英）：

The invention provides an integrated circuit packaging structure. The structure comprises a lead frame, a crystal oscillator and a chip. The crystal oscillator and the chip are connected to the lead frame. The crystal oscillator and the chip are located on a same surface of the lead frame. In the invention, the chip and the crystal oscillator are placed on the same surface of the lead frame so that a product abnormity generated because the lead frame generates deformation when the chip is bonded on the lead frame is avoided, wastes during product production are reduced and production cost is decreased. Simultaneously, internal layout is optimized, and a frequency deviation phenomenon of the crystal oscillator after packaging is eliminated.

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