The invention relates to the field of the manufacturing of semiconductor integrated circuits, especially an integrated circuit encapsulation trim/form die. The trim-form die is composed of a forming concave die, an upper press block, a lower convex die, a rotating shaft, a roller, a roller sliding block, a pressure spring, and a small spring, wherein the forming concave die is arranged on a bottom plate of a press machine to place a package body; the forming convex die is movably connected with an upper template of the press machine through the rotating shaft and the roller; a horizontal small spring is arranged at the lower end of the forming convex die; the upper end of the roller sliding block is connected with the upper template through the pressure spring, and the lower end thereof is movably connected with the small spring. The once forming of a pin terminal of the package body is realized by downward pressing the forming convex die to the forming concave die; the trim/form die is high in processing precision, long in service life, simple in maintenance, and extensively applied to the trim/form process of the integrated circuit encapsulation in various models, and suitable for popularizing and using in the integrated circuit encapsulation enterprise.