The present application relates to a method for producing a patterned substrate. The method can be applied, for example, in the production process for apparatuses such as electronic devices and integrated circuits, or in other uses such as, for instance, the production of integrated optical systems, guidance and detection patterns of magnetic-domain memory, flat displays, liquid crystal displays (LCD), thin-film magnetic heads or organic light-emitting diodes and the like, and can be used to create a surface pattern to be used in producing a discrete track medium of integrated circuits, magnetic storage devices such as bit-patterned mediums and/or hard drives, and the like.