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发明公开
CN107078037A 切割片与半导体芯片的制造方法 有权

切割片与半导体芯片的制造方法
摘要：
本发明提供一种切割片(10)，其具有基材(3)与设置于其一个面上的中间层(2)、以及设置于中间层(2)上的粘着剂层(1)，粘着剂层(1)含有分子内具有能量线固化性双键的化合物，粘着剂层(1)固化前于23℃时的存储弹性模量G’大于中间层(2)于23℃时的存储弹性模量G’，对于粘着剂层(1)固化前的切割片(10)，以JISZ0237:2000为基准相对于硅镜面晶圆进行180°撕除粘着力试验时，所测得的粘着力为2000mN/25mm以上，粘着剂层(1)固化前于23℃时的损失因数tanδ为0.23以上。通过这种切割片(10)，即使将切割片(10)粘贴于半导体晶圆(30)上所得到的层叠体，在规定的时间内静置，也很难发生部分剥离。
摘要（英）：

A dicing sheet 10 is provided with a base 3, an intermediate layer 2 that is provided on one surface of the base 3, and an adhesive layer 1 that is provided on the intermediate layer 2, and wherein: the adhesive layer 1 contains a compound that has an energy ray-curable double bond in each molecule; the storage elastic modulus G' of the adhesive layer 1 before curing is larger than the storage elastic modulus G' of the intermediate layer 2 at 23 DEG C; with respect to the dicing sheet 10 before curing the adhesive layer 1, the peel strength thereof from a silicon mirror wafer is 2,000 mN/25 mm or more as measured by performing a peel strength test at a peeling angle of 180 degrees in accordance with JISZ0237 (2000); and the loss factor tan at 23 DEG C of the adhesive layer 1 before curing is 0.23 or more. This dicing sheet 10 is not susceptible to partial separation even if a laminate, which is obtained by bonding this dicing sheet 10 to a semiconductor wafer 30, is left at rest for a predetermined period of time.

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