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Invention Grant
CN107112384B 包括直接附着引线框架的LED管芯的发光二极管(LED)部件 有权 转让

包括直接附着引线框架的LED管芯的发光二极管(LED)部件
Abstract:
发光二极管(LED)部件包括引线框架和LED，LED使用焊料层电连接到引线框架而无线接合。引线框架包括金属阳极垫、金属阴极垫和塑料杯。LED管芯包括在其上具有焊料层的LED管芯阳极和阴极触件。金属阳极垫、金属阴极垫、塑料杯和/或焊料层被构造为便于将LED管芯直接管芯附着到引线框架而不线接合。还描述了相关的制造方法。
Abstract(English):

A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.

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