Provided are a halogen-free thermosetting resin composition, and a prepreg and laminate for printed circuits using same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids: (A) 5-50 parts of a cyanate resin; (B) 5-40 parts of a polyphenyl ether resin; (C) 5-30 parts of a phosphorus-containing bisphenol polymer; and (D) 30-60 parts of a halogen-free epoxy resin. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition provided have a high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance, high peel strength, excellent heat and humidity resistance and good processability, and can achieve halogen-free flame retardancy and reach the UL94 V-0 grade.