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CN107180816A 一种具有倾斜贯穿硅通道的晶片封装及其制备方法 有权

一种具有倾斜贯穿硅通道的晶片封装及其制备方法
摘要：
本公开的晶片封装包含至少一集成电路晶粒。该至少一集成电路晶粒包含：一基板部，具有位于一前侧与一背侧之间的一内面；位于该前侧上的一电互连部；位于该电互连部的上表面上的至少一第一连接终端；位于该基板部的该背侧上的至少一第二连接终端；电连接该至少一第一连接终端与该至少一第二连接终端的至少一连接线；位于该基板部的该内面与该电互连部的上表面之间的一晶片选择终端；以及一晶片选择线。该晶片选择线连接至该晶片选择终端及该至少一第一连接终端与该至少一第二连接终端其中之一。该晶片选择线与该至少一连接线至少其中之一包含一倾斜部，该倾斜部相对于该基板部的该背侧倾斜。
摘要（英）：

A chip package includes at least one integrated circuit die. The integrated circuit die includes a substrate portion having an internal plane between a front side and a back side, an electrical interconnect portion on the front side, a plurality of first connection terminals on an upper surface of the electrical interconnect portion, a plurality of second connection terminals on the back side of the substrate portion, a plurality of connection wirings electrically connecting the first connection terminals and the second connection terminals, a chip selection terminal between the internal plane of the substrate portion and the upper surface of the electrical interconnect portion, and a chip selection wiring connected to the chip selection terminal and one of the second connection terminals and the first connection terminals. At least one of the chip selection wiring and the plurality of connection wirings includes a tilted portion with respect to the back side of the substrate portion.

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