The substrate inspection method of the present invention is a method of inspecting a conductor pattern formed on a circuit board by checking a current flow rate characteristic of a probe, and determining whether or not the circuit board is qualified based on the measured value of the electrical characteristic value, comprising the steps of: when the measured value is within the allowable range, it is judged as being qualified, and the measurement is repeated without being judged as qualified. When the number of times of measurement has reached the upper limit, the second measurement is performed while changing the direction of the current of the inspection probe in the case where the first measurement value deviates from the allowable range, and the second measurement;when the measured value deviates from the allowable range, the third direction is measured in the direction of the current when the measured value of the first measurement and the difference in the second measurement value is less than the allowable range measurement.