The present disclosure provides an electrostatic chuck and a plasma processing apparatus. The electrostatic chuck includes: a base; a heating layer disposed on the base; an insulating layer disposed on the heating layer; and an annular-shaped protection member surrounding an outer peripheral wall of the heating layer and detachably disposed on an outer side of the heating layer. An outer diameter of the heating layer is smaller than both an outer diameter of the base and an outer diameter of the insulating layer. The electrostatic chuck and the plasma processing apparatus provided by the present disclosure not only protects the heating layer during the manufacturing process, but also can be separately replaced when the annular-shaped protection member is damaged. The heating layer is unaffected during the replacement process. Thus, the electrostatic chuck has the characteristics of long lifespan, and low maintenance and replacement cost, etc.