The invention provides an exposure method. The exposure method is used for exposing a photoresist on a substrate to form a layer structure with a segment difference. The exposure method comprises the following steps: providing a light source, a light filtering hood and n light filters, wherein a light-impermeable area and a light filtering area are arranged on the light filtering hood, the light filtering area is used for transmitting at least two types of light rays, each light filter is used for transmitting one type of light rays, the types of the light rays transmitted by the n light filters are different from one another, and n is greater than or equal to 2; using the light source for sequentially irradiating the n light filters; sequentially using the n light filters for transmitting the light rays; performing n times exposure on the photoresist through the light filtering hood. The invention further provides an exposure device. Through the exposure method and the exposure device, film thickness control can be refined, reduction in a film thickness error is facilitated, debugging of an exposure process is facilitated, a process window is increased, and the yield rate during batch production is increased.