The invention provides a fingerprint recognizing and packaging unit comprising a support plate, a fingerprint sensing chip, at least one drive block, a lead and a packaging layer. The support plate is provided with a line layer which comprises a connecting pad and a first drive contact. The fingerprint sensing chip is provided with a chip electrode which is electrically connected with the connecting pad. The drive blocks are arranged on the support plate, and each drive block comprises a drive body and a conductive layer. The drive body is provided with a bottom surface, a terrace surface and a top surface. The bottom surface contacts the surface of the support plate, and the terrace surface is arranged between the top surface and the bottom surface. The conductive layer is distributed on the top surface and the terrace surface. The lead is a conductive layer which is electrically connected with the first drive contact and arranged on the terrace surface. The lead has camber, and the distance between the top surface and the terrace surface is actually greater than or equal to the camber. The packaging layer at least covers the fingerprint sensing chip, the lead and partial support plate and is exposed out of the conductive layer arranged on the top surface.