The invention provides a pump-driven two-phase circuit device for heat dissipation of a high heat flux electronic device. Heat is collected and transported by using an endothermic process in evaporation and an exothermic process in condensation during a circulation flow process of a working medium. An evaporator for the circuit device comprises micro-channels and fins. In an area of high heat flux, the micro-channels are used to dissipate heat and increase a heat transfer coefficient of a partial area, while in an area of low heat flux, the fins are used. Due to great area difference between the micro-channel area and the fin area in the evaporator, when the working medium in the micro-channels enters the fin area, volume quickly expands and temperature of the working medium reduces, so as to help heat dissipation of the device in the fin area. By using different structures and with little resources, heat dissipation problems of devices with different powers are solved. The pump-driven two-phase circuit device for heat dissipation of the high heat flux electronic device can adapt to heat dissipation of electronic devices with different heat flux densities and can satisfy working requirements of electronic devices with a heat flux density of 50 W/cm<2> or above.