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发明公开
CN107507810A 半导体器件及半导体器件的制造方法 无效 - 撤回

半导体器件及半导体器件的制造方法
摘要：
本发明涉及半导体器件及其制造方法。目的在于提高半导体器件的性能。具有半导体芯片(CH)和散热部(散热器)的半导体器件按以下方式构成。散热部(散热器)具有树脂带(R1)和从该树脂带突出的由石墨片形成的散热片(GF)，散热片具有石墨烯，散热片以石墨烯在与半导体芯片的表面交叉的方向上配置的方式配置于所述半导体芯片上。该散热部为将石墨片与树脂带层叠并卷绕而得到的卷绕体。作为上述散热片的构成材料，通过使用石墨烯，导热性提高且散热性提高。此外，由于使散热片从树脂带飞出，因此散热片的露出面积提高，能够提高散热性。
摘要（英）：

A semiconductor device including a semiconductor chip and a heat dissipation unit (heat sink) is configured as follows. The heat dissipation unit (heat sink) includes a resin tape, and a fin constituted of a graphite sheet and protruding from the resin tape. The fin, including graphene, is disposed on the semiconductor chip such that the graphene is disposed in a direction crossing a surface of the semiconductor chip. The heat dissipation unit is a rolled body in which the graphite sheet and the resin tape are layered and rolled. Thus, by use of the graphene as a constituent material of the fin, thermal conductivity is improved, whereby a heat dissipation characteristic is improved. Furthermore, since the fin is protruded from the resin tape, an exposed area of the fin is increased, and accordingly, the heat dissipation characteristic can be improved.

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