The invention discloses a high-temperature aging testing device for an integrated circuit board, and the device comprises a circuit system and a supporting mechanism. A high-temperature-resistant PCB is employed as a carrier of a transmission line led into a high-temperature box, and the device is provided with a multi-stage interface board, and employs a programmable logic device to output an input test signal to a plurality of connectors where to-be-tested module groups are inserted, thereby achieving the batch testing. The interior of the high-temperature box is provided with an adjustable supporting mechanism and a locking device, and is compatible with adapter boards in different sizes. The distance between the adapter boards can be adjusted, so as to adapt to the to-be-tested module groups in different sizes. The adapter boards remain horizontal under the action of the supporting mechanism, and are provided with dedicated power supply circuits, so as to meet the demands of large-current power supply and solve a problem that a connector cannot transmit a large current. Modules which directly make contact with the circuit board are insulating materials, thereby preventing the charge on the high-temperature box body from be transmitted to a module group so as to avoid the impact on the operation of the module group. The device is simple in structure, is convenient to use, is low in cost, and is high in stability.